PIC32MX564F064H-V/MR - 80MHz 32-bit MCU 64KB Flash USB OTG | Microchip
MPN: PIC32MX564F064H-V/MR ✓ פעילPIC32MX564F064H-V/MR סקירה
A 32-bit microcontroller (MCU) is a programmable processor that integrates a CPU core, memory, and peripherals on a single die. Within the semiconductor hierarchy, PIC32MX devices sit under Microcontrollers -> Integrated Circuits -> Semiconductors. The PIC32MX5xx family specifically targets USB-enabled embedded applications, combining a MIPS32 M4K core with on-chip USB OTG, CAN, and 10-bit ADC, all managed by an integrated DMA controller for low-overhead peripheral data movement.
Key features include 64 KB (64K x 8) Flash program memory, 32 KB SRAM, 80 MHz maximum CPU clock, USB On-The-Go (OTG) full-speed and low-speed transceiver, a 10-bit 1 Msps ADC with up to 16 channels, DMA with multiple channels for offloading CPU transfers, and configurable I/O. The 64-VQFN (9x9 mm) package offers a low-profile surface-mount footprint suitable for compact embedded designs.
Architecturally, the PIC32MX564 uses the MIPS32 M4K core with 5-stage pipeline, Harvard cache, and a peripheral bus that connects USB, ADC, SPI, I2C, UART, and CAN modules to the DMA engine. This architecture delivers deterministic interrupt latency and 1.56 DMIPS/MHz, which is sufficient for USB stack processing, motor control loops, and basic signal processing without external logic.
Typical applications include USB peripherals (HID, CDC, MSD), industrial control with CAN, embedded graphics controllers, low-cost sensor hubs, and consumer devices that need on-board USB connectivity. The integrated USB OTG PHY eliminates an external transceiver and reduces BOM cost.
When designing with this device, allocate sufficient decoupling on VDD/VSS pairs (typically 100 nF per pin) and keep the 80 MHz trace lengths short to avoid EMI. The 64-VQFN package exposes a thermal pad that must be soldered to a continuous ground plane for thermal dissipation and electrical reference.
This page synthesizes distributor pricing, parametric drop-in alternatives, and practical design notes not found in the manufacturer datasheet. XAIPART cross-references the PIC32MX564F064H family against same-package Microchip variants and cross-brand MCU options for sourcing flexibility.
חלופות תחליף ישיר עבור PIC32MX564F064H-V/MR — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MX564F064H-V/MR (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Operating Temperature, Operating Temperature Range, USB.
PIC32MX564F064H-I/MR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX564F064HT-V/MR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX564F064HT-I/MR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX564F128H-I/MR
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC32MX534F064H-I/MR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX470F512H-I/MR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MX564F064H-V/MR דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 M4K |
| Family | PIC32MX5xx |
| רוחב אפיק נתונים | 32-bit |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 32 KB |
| USB Interface | USB OTG (Full-Speed / Low-Speed) |
| ADC | 10-bit, up to 16 channels |
| DMA Channels | Yes (multiple) |
| מארז | 64-pin VQFN (9x9 mm) |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | -40C to +105C |
| Temperature Grade (V suffix) | Extended -40C to +105C |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| סטטוס RoHS | Compliant |
| Lead-Free | Yes |
תצורת פינים של PIC32MX564F064H-V/MR
| פין 1 | RG15 — General purpose I/O |
| פין 2 | VDD — Supply voltage |
| פין 3 | RA0 — General purpose I/O / analog input |
| פין 4 | RA1 — General purpose I/O / analog input |
| פין 5 | RA2 — General purpose I/O / analog input |
| פין 6 | RA3 — General purpose I/O / analog input |
| פין 7 | RA4 — General purpose I/O / analog input |
| פין 8 | RA5 — General purpose I/O / analog input |
| פין 9 | RA6 — General purpose I/O / analog input |
| פין 10 | RA7 — General purpose I/O / analog input |
| פין 11 | RB0 — General purpose I/O / programming |
| פין 12 | RB1 — General purpose I/O / programming |
| פין 13 | RB2 — General purpose I/O |
| פין 14 | RB3 — General purpose I/O |
| פין 15 | RB4 — General purpose I/O |
| פין 16 | RB5 — General purpose I/O |
| פין 17 | RB6 — General purpose I/O / programming clock |
| פין 18 | RB7 — General purpose I/O / programming data |
| פין 19 | RB8 — General purpose I/O |
| פין 20 | RB9 — General purpose I/O |
| פין 21 | RB10 — General purpose I/O |
| פין 22 | RB11 — General purpose I/O |
| פין 23 | VSS — Ground |
| פין 24 | RB12 — General purpose I/O |
| פין 25 | RB13 — General purpose I/O |
| פין 26 | RB14 — General purpose I/O |
| פין 27 | RB15 — General purpose I/O |
| פין 28 | RC1 — General purpose I/O |
| פין 29 | RC2 — General purpose I/O |
| פין 30 | RC3 — General purpose I/O |
| פין 31 | RC4 — General purpose I/O |
| פין 32 | VSS — Ground |
| פין 33 | VDD — Supply voltage |
| פין 34 | RD0 — General purpose I/O |
| פין 35 | RD1 — General purpose I/O |
| פין 36 | RD2 — General purpose I/O |
| פין 37 | RD3 — General purpose I/O |
| פין 38 | RD4 — General purpose I/O |
| פין 39 | RD5 — General purpose I/O |
| פין 40 | RD6 — General purpose I/O |
| פין 41 | RD7 — General purpose I/O |
| פין 42 | RD8 — General purpose I/O |
| פין 43 | RD9 — General purpose I/O |
| פין 44 | RD10 — General purpose I/O |
| פין 45 | RD11 — General purpose I/O |
| פין 46 | VSS — Ground |
| פין 47 | VDD — Supply voltage |
| פין 48 | RD12 — General purpose I/O |
| פין 49 | RD13 — General purpose I/O |
| פין 50 | RD14 — General purpose I/O |
| פין 51 | RD15 — General purpose I/O |
| פין 52 | RF0 — General purpose I/O |
| פין 53 | RF1 — General purpose I/O |
| פין 54 | RG0 — General purpose I/O |
| פין 55 | RG1 — General purpose I/O |
| פין 56 | RG2 — General purpose I/O |
| פין 57 | RG3 — General purpose I/O |
| פין 58 | RG6 — General purpose I/O |
| פין 59 | RG7 — General purpose I/O |
| פין 60 | RG8 — General purpose I/O |
| פין 61 | RG9 — General purpose I/O |
| פין 62 | VSS — Ground |
| פין 63 | OSC1 — Crystal oscillator input |
| פין 64 | OSC2 — Crystal oscillator output |
יישומים טיפוסיים
PIC32MX564F064H-V/MR מתאים עבור 6 יישוםs: USB Human Interface Device (HID) Peripherals, Industrial CAN Node Controllers, USB Barcode Scanners and POS Terminals, USB Audio Class Devices, Embedded Sensor Hubs and IoT Edge Nodes, USB-to-UART / USB-to-SPI Bridge Modules.
USB Human Interface Device (HID) Peripherals
The PIC32MX564F064H-V/MR's integrated USB OTG transceiver and DMA controller make it ideal for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. The 80 MHz MIPS32 M4K core provides sufficient headroom to run the USB stack, descriptor parsing, and HID report generation without external logic. With 64 KB Flash the device accommodates Microchip's MPLAB Harmony USB stack plus HID report handlers, while 32 KB SRAM covers ring buffers and endpoint RAM. Placing a 100 nF decoupling capacitor at each VDD/VSS pair and a 1 uF bulk capacitor near the USB VBUS pin ensures stable USB Full-Speed signalling per USB 2.0 spec.
מומלץ
Industrial CAN Node Controllers
Industrial automation nodes using CAN bus benefit from the PIC32MX564F064H-V/MR's integrated CAN module and extended -40C to +105C operating range. The 80 MHz core delivers deterministic interrupt response for CAN message handling, while the multi-channel DMA offloads CAN RX/TX buffer transfers from the CPU. The 10-bit ADC with up to 16 channels can sample analog sensors in parallel with CAN traffic, reducing external ADC cost. The 64-VQFN package with thermal pad enables compact IP67-rated field-mount designs when soldered to a continuous ground plane.
מומלץ
USB Barcode Scanners and POS Terminals
Point-of-sale terminals, barcode scanners, and receipt printers require reliable USB connectivity plus enough processing power for decoding and I/O management. The PIC32MX564F064H-V/MR runs at 80 MHz which is more than adequate for 1D/2D barcode decoding algorithms and USB CDC/ECP emulation. The 64 KB Flash stores the USB stack and application firmware, while the DMA channels allow background data transfer from a serial barcode sensor to USB endpoint memory. The 10-bit ADC can monitor battery voltage or thermal printer head temperature, reducing the need for an external supervisor.
מומלץ
USB Audio Class Devices
USB speakers, USB headsets, and USB audio streaming dongles leverage the PIC32MX564F064H-V/MR's full-speed USB plus 10-bit ADC or PWM for basic audio rendering. The DMA controller moves USB isochronous endpoint data directly to PWM or I2S peripherals, keeping the CPU free for envelope and volume control tasks. At 80 MHz the core has enough headroom for a 48 kHz stereo USB Audio Class 1.0 stack with minimal jitter. The 64-VQFN package fits inside compact audio dongle enclosures with single-layer ground pours for EMI mitigation.
מומלץ
Embedded Sensor Hubs and IoT Edge Nodes
IoT edge nodes that aggregate multiple sensor interfaces (I2C, SPI, UART) and stream data over USB benefit from the PIC32MX564F064H-V/MR's mix of peripherals. The 80 MHz core executes sensor fusion and protocol conversion locally, while DMA channels offload streaming samples from the 10-bit ADC to memory. USB OTG allows the node to act as either a USB device or a limited USB host, useful for commissioning via USB mass storage. The extended -40C to +105C range supports outdoor enclosures without additional thermal management.
מומלץ
USB-to-UART / USB-to-SPI Bridge Modules
Field-upgradeable bridges that expose legacy UART or SPI peripherals over USB use the PIC32MX564F064H-V/MR as a cost-effective bridge controller. The integrated USB OTG full-speed PHY removes the need for an external bridge IC, and the 80 MHz core runs CDC class drivers plus protocol translation with headroom. The 64 KB Flash stores USB stack plus command parsers, while 32 KB SRAM holds buffer queues. The 64-VQFN package supports very compact bridge dongle designs and the -40C to +105C range covers industrial cabinet installations.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MX564F064H-V/MR — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MX564F064H-I/MR | PIC32MX564F064HT-V/MR | PIC32MX564F064HT-I/MR | PIC32MX564F128H-I/MR | PIC32MX534F064H-I/MR | PIC32MX470F512H-I/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Core | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz |
| Flash | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB | 64 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 128 KB |
| USB OTG | Yes (Full/Low Speed) | Yes | Yes | Yes | Yes | No | Yes |
| Operating Temperature | -40C to +105C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
מבדילים עיקריים
- Integrated USB OTG full/low-speed transceiver (לעומתPIC32MX534F064H-I/MR)
- Extended -40C to +105C operating range (לעומתPIC32MX564F064H-I/MR)
- Tape-and-reel packaging variant available (לעומתPIC32MX564F064H-V/MR (tray))
הערות תכנון
Place one 100 nF ceramic decoupling capacitor adjacent to every VDD/VSS pair on the PIC32MX564F064H-V/MR. Add a single 1 uF to 4.7 uF bulk capacitor at the package entry. The core voltage range is 2.3 V to 3.6 V. For USB bus-powered designs add a 4.7 uF tantalum on VBUS to meet USB inrush transients. Estimated: at 80 MHz full activity the core draws ~70 mA; verify against actual peripheral activity budget before finalising the regulator.
The 64-VQFN package has an exposed thermal pad (EP) on the underside that must be soldered to a continuous ground plane on the top PCB layer. Provide at least 8 thermal vias in the EP pad (0.3 mm drill, 0.5 mm pitch) to inner ground layers. Without EP soldering, junction-to-ambient thermal resistance (theta_JA) rises sharply and the part may throttle under sustained 80 MHz + USB traffic. Estimated: a properly soldered EP drops theta_JA from ~40 C/W toward ~25 C/W in a 4-layer board.
Do not leave the USB D+/D- pins floating when the USB module is unused; tie them to ground through 10 kohm pull-downs to avoid false enumeration. The VBUS pin must see 5 V through a 10 uF bulk when the device acts as a USB device. Configuration bits (DEVCFG0/1/2/3) must be programmed early in the firmware - leaving them at default can disable JTAG and lock the device. Verify all unused I/O are configured as outputs (not inputs) to minimise current leakage in sleep modes.
מידע על תאימות
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is an industrial/consumer-grade MCU. Halogen-free status not explicitly stated in the verified data.
