S9S08DZ60F1MLC - 8-bit MCU, 60KB Flash, CAN, 32-LQFP | NXP
MPN: S9S08DZ60F1MLC ✓ פעילS9S08DZ60F1MLC סקירה
An 8-bit microcontroller (MCU) is a single-chip processor with on-board Flash program memory, RAM, peripherals, and interrupt control, optimized for embedded control in cost-sensitive and real-time systems. The HCS08 core is the enhanced successor to the HC08 architecture, offering the same HC08 instruction set with the addition of BGND (background debug) and higher code density. Within the broader hierarchy, the S08DZ60 belongs to the microcontrollers (MCU) category of integrated circuits, then to the 8-bit MCU subcategory, then to the automotive-grade segment.
Key features include 60 KB Flash (60K x 8), 4 KB SRAM, on-chip EEPROM emulation, an MSCAN controller for CAN 2.0A/B networking, a 40 MHz CPU with a 20 MHz bus, and support for up to 32 interrupt/reset sources. The S9S08DZ60F1MLC variant carries the M74K mask set designation ("MASK ONLY-AUTO") and is qualified to automotive temperature grade (-40C to +125C). The 32-LQFP (7x7 mm) package supports surface-mount assembly and provides ample GPIO for body, chassis, and sensor interface applications.
Typical applications include automotive body controllers, CAN nodes (door modules, seat controllers, mirror modules), industrial sensor hubs, LIN/CAN gateway bridges, and low-end instrument clusters. The combination of on-chip CAN and 60 KB Flash simplifies BOM and PCB layout in distributed automotive networks.
When designing with this MCU, ensure the BDS (background debug) interface is accessible for in-circuit programming and that the VDDA/VREF decoupling follows NXP reference design guidance. Use the on-chip CAN controller with an external CAN transceiver (e.g. TJA1050 or TJA1040). The "F1" mask set designation means the part is shipped with the F1 firmware mask pre-programmed, so this SKU is intended for production runs against the M74K firmware baseline rather than for general development.
This page synthesizes distributor pricing, drop-in alternative MPNs (same LQFP-32 footprint), and practical design considerations for production engineers, providing actionable information not found in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור S9S08DZ60F1MLC — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם S9S08DZ60F1MLC (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core, Operating Temperature, Program Memory Size, RAM.
S9S08DZ60F2MLC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
S9S08DZ60F1MLF
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S9S08DZ60F2MLF
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S9S08DZ60F1MLH
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
S9S08DZ96F2MLH
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←S9S08DZ60F1MLC דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | HCS08 (enhanced HC08 with BGND) |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Flash | 60 KB (60K x 8) |
| RAM | 4 KB |
| CAN Controller | MSCAN (CAN 2.0A/B), 1 channel |
| SCI/UART | 2 channels |
| SPI | 1 channel |
| I2C | 1 channel |
| טמפרטורת פעולה | -40C to +125C (automotive grade) |
| מארז | 32-LQFP (7x7 mm) |
| Mask Set / Marking | M74K (MASK ONLY-AUTO) |
| סוג הרכבה | Surface Mount |
מדריך תצורת פינים של S9S08DZ60F1MLC 32-lqfp (7x7 mm)
תצורת פינים עבור S9S08DZ60F1MLC (מארזת 32-lqfp (7x7 mm)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור S9S08DZ60F1MLC.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
S9S08DZ60F1MLC מתאים עבור 6 יישוםs: Automotive Body Control Module (BCM), CAN Node / Door Module, Industrial CAN Sensor Hub, Automotive Lighting Controller, HVAC Control Panel Interface, Battery Management Slave (Low-Voltage Cell Monitor).
Automotive Body Control Module (BCM)
The S9S08DZ60F1MLC fits automotive body controllers because its integrated MSCAN (CAN 2.0A/B), 60 KB Flash, 4 KB SRAM, and -40C to +125C automotive temperature grade cover typical BCM requirements. The HCS08 core running at 40 MHz with a 20 MHz bus delivers 20 MIPS, sufficient for CAN stack processing, lighting control logic, and switch/wake-up debouncing. The 32-LQFP footprint is small enough for space-constrained BCM PCBs that sit behind the dash. Place the MCU between the CAN bus transceiver and the load-driver FETs; the on-chip MSCAN eliminates the need for an external CAN controller IC, reducing BOM by one part versus older designs that paired an HC08 with a stand-alone CAN peripheral.
מומלץ
CAN Node / Door Module
Door modules (window lift, mirror adjust, lock/unlock) are a primary target for the S9S08DZ60F1MLC. The 60 KB Flash accommodates a CANopen or OEM proprietary stack plus the application state machine, while 4 KB SRAM is enough for CAN message buffering and per-window position tracking. The automotive temperature grade matches door-mounted environments that see full cabin thermal swings. Use the 2x SCI channels for LIN sub-bus expansion (with external LIN transceiver) for mirror buttons or window switches, and the SPI channel for an external LED controller or stepper driver.
מומלץ
Industrial CAN Sensor Hub
The S9S08DZ60F1MLC is well-suited for industrial sensor hubs that aggregate analog/digital sensor data and publish it on a CANopen or DeviceNet backbone. The HCS08 core has deterministic interrupt response suitable for time-triggered sensor polling, and the 60 KB Flash hosts the CANopen stack plus sensor-processing firmware. For industrial environments outside the automotive temperature window, the industrial-grade F1MLF variant in the same LQFP-32 package is a direct drop-in. Connect ADC inputs to industrial sensors (4-20 mA loop, RTD, thermistor bridge) and use the SCI channel as a Modbus UART service interface.
מומלץ
Automotive Lighting Controller
Interior and exterior lighting controllers benefit from the S9S08DZ60F1MLC's combination of MSCAN, PWM-capable timers, and automotive temperature grade. The 60 KB Flash comfortably fits LED fade logic, CAN-based lighting commands (e.g. daylight running, sequential turn signals), and diagnostic handlers (lamp-out detection via current sense). Use PWM outputs to drive LED driver ICs and the MSCAN module to receive lighting commands from the BCM. The 32-LQFP package supports 0.8 mm lead pitch, which keeps the PCB smaller than 64- or 80-pin QFP lighting controllers used in higher-end designs.
מומלץ
HVAC Control Panel Interface
HVAC control panels need a low-cost MCU with CAN, enough Flash for fan/blower PID loops, and a small QFP footprint. The S9S08DZ60F1MLC satisfies all three: 60 KB Flash for the HVAC state machine, MSCAN for chassis-CAN communication, and 32-LQFP for compact panel PCBs. Use the I2C bus to talk to an LCD or OLED display controller, the SPI bus to drive rotary encoder inputs, and SCI as a service/UART diagnostic port. The automotive temperature grade ensures reliable operation inside the dashboard across full climate extremes.
מומלץ
Battery Management Slave (Low-Voltage Cell Monitor)
The S9S08DZ60F1MLC can serve as a low-voltage slave in distributed battery management architectures for 12V/48V automotive batteries. Its 60 KB Flash holds cell-balancing logic, temperature derating tables, and CAN reporting firmware; MSCAN links it to the master BMS over an isolated CAN bus. The 32-LQFP is small enough to fit on a per-cell PCB behind a battery module. Although this MCU lacks a high-voltage analog front end, paired with an external AFE such as the MC33771 or L9963, it provides the CAN networking, diagnostics, and housekeeping layer.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור S9S08DZ60F1MLC — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | S9S08DZ60F2MLC | S9S08DZ60F1MLF | S9S08DZ60F2MLF | S9S08DZ60F1MLH | S9S08DZ96F2MLH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Flash | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB | 96 KB |
| CPU Speed | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus |
| Mask Set / Marking | M74K (F1, MASK ONLY-AUTO) | F2 mask | M74K F1 industrial | F2 mask industrial | F1 mask alt reel | F2 mask, larger Flash |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Industrial | Industrial | Automotive | Automotive |
| CAN Controller | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 6 KB |
מבדילים עיקריים
- F1 mask set pre-locked for production with M74K firmware baseline (לעומתS9S08DZ60F2MLC (F2 mask))
- Same 32-LQFP footprint across DZ60 family enables BOM consolidation (לעומתS9S08DZ96F2MLH (96 KB Flash, same package))
- 8-bit HCS08 architecture with deterministic interrupt latency (לעומת32-bit Kinetis KE02 or S32K MCU)
הערות תכנון
Estimated: Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed as close to the pins as possible (within 2 mm trace length). Add a bulk 10 uF tantalum or polymer capacitor near the MCU to supply transient current during MSCAN bus-state changes. The S08DZ60 family has separate VDDA/VREF pins - tie a 100 nF + 1 uF RC network to VREF for ADC reference stability. Per the MC9S08DZ60 datasheet, VDD must ramp monotonically from 0 V to operating voltage in less than the POR reset spec window; add a reset supervisor if the upstream regulator has slow or non-monotonic start-up.
Route the CANH/CANL differential pair from the external transceiver to the bus connector with 120 ohm characteristic impedance and matched length (delta < 5 mm). Keep the MCU's TXCAN/RXCAN traces short and away from switching load-driver traces (>3 mm clearance). The 32-LQFP ground paddle should be soldered to a continuous ground pour to provide thermal relief; the S08DZ60 family dissipates <100 mW in typical body-control use, so the ground pour is mainly for EMI shielding rather than heat sinking.
Do not assume any two S9S08DZ60 mask-set SKUs share firmware compatibility - the F1 (M74K) and F2 (M74L or later) mask sets may have minor silicon errata differences that affect ADC calibration, low-voltage detect (LVD) thresholds, and Flash erase timing. Verify firmware compatibility with the NXP errata sheet for the specific mask set before substituting F1 and F2 SKUs in production. Also avoid powering the MCU before its VDD has stabilized, or you may corrupt the Flash security byte and brick the part. Program the Flash security byte only after firmware has been fully validated.
When using the S9S08DZ60F1MLC's MSCAN at 1 Mbit/s, the TXCAN output has a propagation delay asymmetry budget of ~250 ns. Add a series 100 ohm-1 nF RC snubber on CANH/CANL if the bus length exceeds 10 m or if you observe ringing above 50 mV peak. For SCI/UART baud rates above 115.2 kbps, ensure the UART baud-rate error is below 2% by selecting appropriate bus-clock divider values; the HCS08 SCI is more sensitive to baud-rate error than modern UART peripherals.
מידע על תאימות
AEC-Q100 qualified per automotive mask-set marking ("MASK ONLY-AUTO") and -40C to +125C operating range. Explicit RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not present in the verified web data; set to 'unknown' rather than guess.