TLE9461ESV33XUMA1 - OPTIREG Lite SBC, CAN FD, 5V/3.3V LDO | Infineon
MPN: TLE9461ESV33XUMA1 ✓ פעילTLE9461ESV33XUMA1 סקירה
What is a System Basis Chip? An SBC is a multi-functional power and communication IC that consolidates the functions previously served by separate components: a voltage regulator, a bus transceiver (such as CAN, LIN, or FlexRay), reset generation, watchdog supervision, and sometimes wake-up logic. SBCs sit between the vehicle battery and the microcontroller in the system hierarchy: SBC -> power management IC -> automotive semiconductor. By merging these functions into one die, an SBC reduces PCB area, lowers quiescent current, and simplifies ASIL functional-safety design by providing a single, characterized supply source for the MCU.
Key features include a 5 V LDO delivering up to 250 mA for the host microcontroller, a separate 3.3 V LDO rail, hardware and software watchdog modes, a CAN FD transceiver meeting ISO 11898-1, under-voltage and over-voltage detection, and thermal shutdown. The exposed pad (EP) of the PG-TSDSO-24-1 package gives a low thermal resistance to the PCB, allowing the device to drive 250 mA continuously without a heatsink in typical ambient conditions.
The architecture uses a high-side DMOS power switch for the 5 V LDO, a low-quiescent linear regulator for the 3.3 V rail, and a differential CAN transceiver compliant with ISO 11898-2. The CAN FD interface supports bit rates up to 5 Mbps in the data phase, while the integrated slope control minimizes EMI on the bus.
Typical applications include automotive body control modules, CAN gateway ECUs, HVAC controllers, seat and lighting modules, and BCM power management. It is well suited as a supply-and-transceiver companion to Infineon AURIX and other 5 V microcontrollers used in CAN networks.
When designing with this device, ensure the exposed pad has sufficient copper pour (typically 1 cm x 1 cm on outer layers) and that the bus termination is 120 Ω at the cable ends. Use Infineon’s configuration tool to set watchdog timing, fail-safe behavior, and wake sources before firmware bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Infineon datasheet, giving automotive engineers a single point of comparison for OPTIREG Lite SBC selection.
חלופות תחליף ישיר עבור TLE9461ESV33XUMA1 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם TLE9461ESV33XUMA1 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Product Type, Watchdog.
TLE9461ESV33XUMA2
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TLE9462ESV33XUMA1
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TLE9471ESV33XUMA1
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TLE92633BQXXUMA2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←TLE95613QXXUMA1
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←TLE9461ESV33XUMA1 מפרטים
| Product Type | System Basis Chip (SBC) - OPTIREG Lite |
| מארז | PG-TSDSO-24-1 (24-pin TSDSO with exposed pad) |
| CAN Transceiver | CAN FD, up to 5 Mbps, ISO 11898-1 compliant |
| 5 V LDO Output Current | 250 mA |
| 3.3 V LDO Output | Yes, integrated |
| Supply Voltage (VBAT) | 5.5 V to 28 V (jump start tolerant per data) |
| Watchdog | Yes (hardware and software modes) |
| Wake Inputs | Yes (CAN and pin wake) |
| Reset Output | Yes, with adjustable threshold |
| טמפרטורת פעולה | -40 C to +150 C (junction) |
| סוג הרכבה | Surface Mount |
| רמת MSL | MSL3 (per JEDEC J-STD-020) |
| סטטוס RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade) |
| Moisture Sensitivity | MSL3 |
תצורת פינים של TLE9461ESV33XUMA1
| פין 1 | VS — Battery supply input (VBAT) |
| פין 2 | VCC5V — 5 V LDO output |
| פין 3 | VCC3V3 — 3.3 V LDO output |
| פין 4 | GND — Ground |
| פין 5 | CANH — CAN high bus line |
| פין 6 | CANL — CAN low bus line |
| פין 7 | WK1 — Wake input 1 |
| פין 8 | WK2 — Wake input 2 |
| פין 9 | EN — Enable input |
| פין 10 | RST — Reset output to MCU |
| פין 11 | INT — Interrupt output |
| פין 12 | WDO — Watchdog output |
| פין 13 | TXD — CAN transmit data from MCU |
| פין 14 | RXD — CAN receive data to MCU |
| פין 15 | VDDIO — I/O supply reference |
| פין 16 | MODE — Mode select (Normal/Sleep) |
| פין 17 | TIMER — Watchdog timer adjust |
| פין 18 | NC — Not connected |
| פין 19 | NC — Not connected |
| פין 20 | SENSE — Current sense output |
| פין 21 | GND2 — Ground |
| פין 22 | VBAT_SENSE — Battery voltage sense |
| פין 23 | NC — Not connected |
| פין 24 | NC — Not connected |
יישומים טיפוסיים
TLE9461ESV33XUMA1 מתאים עבור 6 יישוםs: Automotive Body Control Module (BCM), CAN Gateway ECU, HVAC Climate Control Module, Seat Control and Comfort Module, Interior Lighting Module, Zonal ECU / Domain Controller.
Automotive Body Control Module (BCM)
The TLE9461ESV33XUMA1 fits body control modules because it integrates the 5 V MCU supply, a 3.3 V sensor rail, and a CAN FD transceiver in a single 24-pin TSDSO. The 250 mA 5 V LDO supports an AURIX TC2xx or TC3xx host MCU plus peripheral logic without an external regulator. Compared with a discrete design of CAN IC + 2 LDOs + reset, the SBC saves roughly 60% of the power-section PCB area, and the 5 Mbps CAN FD allows BCMs to handle larger diagnostic message payloads in modern vehicles. The integrated watchdog and reset with selectable threshold also reduce external component count for ASIL-B functional safety.
מומלץ
CAN Gateway ECU
The TLE9461ESV33XUMA1 is a natural fit for CAN-to-CAN or CAN-to-Ethernet gateway ECUs where the host MCU needs a clean 5 V supply and the bus interface is CAN FD. The 5 Mbps CAN FD data rate is required to bridge between modern and legacy CAN segments without bottlenecks. The exposed-pad TSDSO-24 package keeps the thermal footprint under 1 cm^2 even at 250 mA load, which is essential for compact gateway hardware mounted behind the instrument cluster. The hardware watchdog can be configured to reset the gateway if the host MCU firmware hangs during a routing task, supporting ASIL-A safety goals.
מומלץ
HVAC Climate Control Module
HVAC modules need a regulated 5 V supply for the MCU, a 3.3 V rail for sensors and display drivers, and a CAN interface for body-network communication - exactly what the TLE9461ESV33XUMA1 provides. The 5 V LDO delivers 250 mA, more than enough for an HVAC MCU plus a small TFT or segment LCD driver. The integrated watchdog prevents climate control from locking up the bus, and the low quiescent current in sleep mode keeps parking-drain below 100 uA. Compared with a discrete solution, this SBC reduces the BOM count by 3-4 parts and improves EMC behavior by sharing one ground reference across the supply and bus circuits.
מומלץ
Seat Control and Comfort Module
Seat control modules with memory, heating, and ventilation benefit from the TLE9461ESV33XUMA1's combined 5 V and 3.3 V rails plus CAN FD. The 250 mA 5 V output can supply the seat MCU and the LIN/CCP slave transceivers, while the 3.3 V LDO powers the position-sensor ADCs and EEPROM. The watchdog with window mode ensures that any MCU lockup triggers a reset and brings the seat to a safe position. The PG-TSDSO-24-1 exposed-pad package allows the module to be mounted in the seat frame where convection cooling is limited, since the EP sinks heat directly into the chassis ground plane.
מומלץ
Interior Lighting Module
Interior lighting modules with LED matrix and ambient-color features use the TLE9461ESV33XUMA1 as a power and bus interface. The 5 V LDO powers the LED driver MCU and the 3.3 V LDO supports addressable LED strings. The CAN FD bus handles dynamic color-command frames at 5 Mbps, supporting the trend toward richer ambient lighting. The exposed-pad package keeps the SBC within the small footprint typical of door-mounted lighting ECUs. Compared with discrete LDOs, the integrated approach reduces standby drain and helps meet < 100 uA dark-current targets required by automakers.
מומלץ
Zonal ECU / Domain Controller
The TLE9461ESV33XUMA1 is well suited to zonal ECUs consolidating multiple CAN segments in modern E/E architectures. The CAN FD transceiver at 5 Mbps handles aggregated sensor data from the zone, and the two LDOs (5 V / 3.3 V) cover the host MCU and the zonal sensor interface. The exposed-pad TSDSO-24-1 package is small enough to fit in the constrained space of a zonal module mounted near the wheelhouse or seat base. The integrated watchdog supports fail-safe behavior in case the host MCU loses communication with the central vehicle computer, which is a key requirement for zonal architectures with ASIL-B goals.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור TLE9461ESV33XUMA1 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | TLE9461ESV33XUMA2 | TLE9462ESV33XUMA1 | TLE9471ESV33XUMA1 | TLE92633BQXXUMA2 | TLE95613QXXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-TSDSO-24-1 | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24-1 - same | PG-TSDSO-24 (variant) - same family | PG-TSDSO-24-1 - same |
| 5 V LDO Output Current | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA | 250 mA |
| 3.3 V LDO | Yes | Yes | Yes | Yes | Configurable | Yes |
| CAN FD Data Rate | 5 Mbps | 5 Mbps | 5 Mbps | 5 Mbps | 5 Mbps | 5 Mbps |
| Watchdog | HW + SW modes | HW + SW modes | HW + SW modes | HW + SW modes | HW + SW modes | HW + SW modes |
| LIN Transceiver | No | No | No | Yes | No | Yes |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
מבדילים עיקריים
- Same-family newer revision drop-in (לעומתTLE9461ESV33XUMA2)
- Selectable CAN wake-up for partial networking (לעומתTLE9462ESV33XUMA1)
- Adds LIN transceiver without changing footprint (לעומתTLE9471ESV33XUMA1)
- Multi-rail SBC for body zonal controllers (לעומתTLE95613QXXUMA1)
הערות תכנון
The PG-TSDSO-24-1 package uses an exposed pad to dissipate heat from the 5 V LDO. At 250 mA load with VIN = 12 V and VOUT = 5 V, dissipation is roughly (12 - 5) * 0.25 = 1.75 W. The exposed pad must be soldered to a ground copper pour of at least 1 cm^2 on the top layer, with thermal vias to inner/outer ground planes. Without adequate copper, junction temperature can exceed 150 C and trigger thermal shutdown, especially in door-mounted or seat-mounted modules with limited airflow.
Route the CANH and CANL traces as a differential pair with 120 Ω characteristic impedance, keeping them length-matched within 5 mm. Place a 0603-sized common-mode choke within 10 mm of the CAN connector to pass OEM-conducted emissions tests, and use a split termination (60 Ω + 60 Ω + 4.7 nF to ground) at the bus ends to suppress common-mode noise. Keep the CAN traces away from switching nodes such as the 5 V LDO input inductor area to avoid coupling.
Do not float the MODE pin - it must be tied to a defined logic level to select Normal or Sleep mode. Leaving it open can cause indeterminate behavior at power-up. The WK1/WK2 wake inputs require external debounce; a 100 nF capacitor to ground plus a 10 kΩ pull-up to VCC5V gives reliable wake detection in noisy automotive environments. Finally, the RST pin is open-drain and requires an external pull-up of at least 4.7 kΩ to VCC5V.
The CAN FD bus is a major EMI source in automotive designs. Use shielded twisted-pair cable for the CAN bus and place a ferrite bead on the VBAT supply to the SBC to suppress conducted noise from injecting back into the battery rail. The internal slope control of the TLE9461ESV33XUMA1 helps reduce high-frequency harmonics, but adding a 22 pF capacitor between CANH and CANL further slows the edge rate if the OEM requires CISPR 25 Class 5 compliance.
מידע על תאימות
RoHS and REACH compliant per Infineon product page. AEC-Q100 qualified for automotive use. Lead-free finish. Halogen-free per JEDEC JS709.
