10AS057K2F35E1HG vs 10AS048K2F35E1HG तुलना
विस्तृत दोनों ओर की तुलना 10AS057K2F35E1HG द्वारा Intel और 10AS048K2F35E1HG द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10AS057K2F35E1HG | 10AS048K2F35E1HG |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Arria 10 SX | — |
| Logic Elements | 570,000 | 480,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: total M20K + MLAB bits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | 396 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: number of GX/GT channels and data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| पैकेज | 1152-ball FC-BGA (F35), 35x35 mm | 1152-BBGA, FCBGA, 35 x 35 mm |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Operating Temperature Grade | Industrial | — |
| RoHS स्थिति | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Product Family | — | Arria 10 SX SoC FPGA |
| DSP Blocks | — | 1,518 (variable-precision, IEEE 754 FP) |
| Adaptive Logic Modules (ALMs) | — | 190,240 |
| ऑपरेटिंग तापमान | — | 0C to 100C (E1 = Enhanced, 0C to 100C) |
| Speed Grade | — | K2 |
| Hard Memory Controllers | — | DDR3/DDR4 with ECC support |
| HPS Peripherals | — | USB 2.0 OTG, GbE, SD/SDIO/MMC, UART, SPI, I2C, CAN |
| Security Features | — | AES, SHA, RSA, TrustZone, secure boot, anti-tamper |
| माउंटिंग प्रकार | — | Surface Mount (BGA) |