10AS057K2F35E1HG vs 10AS048K2F35E1HG 比較
詳細並排比較 10AS057K2F35E1HG 由 Intel 與 10AS048K2F35E1HG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10AS057K2F35E1HG | 10AS048K2F35E1HG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria 10 SX | — |
| Logic Elements | 570,000 | 480,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: total M20K + MLAB bits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | 396 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: number of GX/GT channels and data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| 封裝 | 1152-ball FC-BGA (F35), 35x35 mm | 1152-BBGA, FCBGA, 35 x 35 mm |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Operating Temperature Grade | Industrial | — |
| RoHS 狀態 | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Product Family | — | Arria 10 SX SoC FPGA |
| DSP Blocks | — | 1,518 (variable-precision, IEEE 754 FP) |
| Adaptive Logic Modules (ALMs) | — | 190,240 |
| 工作溫度 | — | 0C to 100C (E1 = Enhanced, 0C to 100C) |
| Speed Grade | — | K2 |
| Hard Memory Controllers | — | DDR3/DDR4 with ECC support |
| HPS Peripherals | — | USB 2.0 OTG, GbE, SD/SDIO/MMC, UART, SPI, I2C, CAN |
| Security Features | — | AES, SHA, RSA, TrustZone, secure boot, anti-tamper |
| 安裝類型 | — | Surface Mount (BGA) |