10AS057K2F35E1HG vs 10AS048K2F35E1HG Perbandingan
Perbandingan bersamaan detil 10AS057K2F35E1HG dari Intel dan 10AS048K2F35E1HG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10AS057K2F35E1HG | 10AS048K2F35E1HG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | — |
| Logic Elements | 570,000 | 480,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: total M20K + MLAB bits] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | 396 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: number of GX/GT channels and data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Paket | 1152-ball FC-BGA (F35), 35x35 mm | 1152-BBGA, FCBGA, 35 x 35 mm |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Operating Temperature Grade | Industrial | — |
| Status RoHS | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Product Family | — | Arria 10 SX SoC FPGA |
| DSP Blocks | — | 1,518 (variable-precision, IEEE 754 FP) |
| Adaptive Logic Modules (ALMs) | — | 190,240 |
| Suhu Kerja | — | 0C to 100C (E1 = Enhanced, 0C to 100C) |
| Speed Grade | — | K2 |
| Hard Memory Controllers | — | DDR3/DDR4 with ECC support |
| HPS Peripherals | — | USB 2.0 OTG, GbE, SD/SDIO/MMC, UART, SPI, I2C, CAN |
| Security Features | — | AES, SHA, RSA, TrustZone, secure boot, anti-tamper |
| Tipe Mounting | — | Surface Mount (BGA) |