5CGXBC5C7F27C8N vs 5CGXBC9D6F27C7N तुलना
विस्तृत दोनों ओर की तुलना 5CGXBC5C7F27C8N द्वारा Intel और 5CGXBC9D6F27C7N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 5CGXBC5C7F27C8N | 5CGXBC9D6F27C7N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Cyclone® V GX | Cyclone V GX |
| Logic Elements (LE) | 77,000 | — |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | GX family transceivers (per package variant) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes, Gen1/Gen2 |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| पैकेज | 672-pin FBGA (F27, 27 mm × 27 mm) | 672-ball FBGA |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| RoHS स्थिति | Compliant | Compliant |
| Logic Elements | — | 301,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 14,251,008 bits |
| Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Embedded Multipliers (18x18) | — | 336 |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| I/O Voltage Support | — | 1.2 V to 3.3 V (bank-dependent) |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for FBGA-672] |
| Process Technology | — | 28 nm TSMC low-power |
| Speed/Grade | — | C7 (commercial, speed grade 7) |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |