5CGXBC5C7F27C8N vs 5CGXBC9D6F27C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CGXBC5C7F27C8N disebabkan oleh Intel dan 5CGXBC9D6F27C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 5CGXBC5C7F27C8N | 5CGXBC9D6F27C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone® V GX | Cyclone V GX |
| Logic Elements (LE) | 77,000 | — |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | GX family transceivers (per package variant) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes, Gen1/Gen2 |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| Kemasan | 672-pin FBGA (F27, 27 mm × 27 mm) | 672-ball FBGA |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Suhu Operasi | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 301,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 14,251,008 bits |
| Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Embedded Multipliers (18x18) | — | 336 |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| I/O Voltage Support | — | 1.2 V to 3.3 V (bank-dependent) |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for FBGA-672] |
| Process Technology | — | 28 nm TSMC low-power |
| Speed/Grade | — | C7 (commercial, speed grade 7) |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |