A3PE3000-FG484 vs A3PE3000L-FG484 तुलना
विस्तृत दोनों ओर की तुलना A3PE3000-FG484 द्वारा Microchip Technology और A3PE3000L-FG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ सक्रियMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3PE3000-FG484 | A3PE3000L-FG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3E Flash FPGA | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Cells (DFEs) | 75264 | — |
| User I/O | 341 | — |
| Core Voltage | 1.5 V | — |
| System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash CMOS | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| पैकेज | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Soft CPU Support | Optional soft ARM support | — |
| Differential I/O Standards | LVDS, LVPECL | — |
| Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Packaging | Tray | — |
| RoHS स्थिति | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) | [DATA_NEEDED: RoHS compliance] |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | [DATA_NEEDED: Embedded RAM block capacity] |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |