A3PE3000-FG484 vs A3PE3000L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-FG484 | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E Flash FPGA | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Cells (DFEs) | 75264 | — |
| User I/O | 341 | — |
| Core Voltage | 1.5 V | — |
| System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash CMOS | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Packhaging | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Soft CPU Support | Optional soft ARM support | — |
| Differential I/O Standards | LVDS, LVPECL | — |
| Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Packaging | Tray | — |
| Tindminan RoHS | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) | [DATA_NEEDED: RoHS compliance] |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | [DATA_NEEDED: Embedded RAM block capacity] |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |