A3PE3000-FG484 vs A3PE3000L-FG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-FG484 disebabkan oleh Microchip Technology dan A3PE3000L-FG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ AktifMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000-FG484 | A3PE3000L-FG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E Flash FPGA | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Cells (DFEs) | 75264 | — |
| User I/O | 341 | — |
| Core Voltage | 1.5 V | — |
| System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash CMOS | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Kemasan | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Soft CPU Support | Optional soft ARM support | — |
| Differential I/O Standards | LVDS, LVPECL | — |
| Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Packaging | Tray | — |
| Status RoHS | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) | [DATA_NEEDED: RoHS compliance] |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | [DATA_NEEDED: Embedded RAM block capacity] |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |