ATSAM4S-WPIR-RD vs ATSAM4CP16C-EK तुलना
विस्तृत दोनों ओर की तुलना ATSAM4S-WPIR-RD द्वारा Microchip Technology और ATSAM4CP16C-EK द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
ATSAM4S-WPIR-RD - SAM4S16 PIR Camera Reference Design | Microchip
ATSAM4S-WPIR-RD ✓ सक्रियMicrochip Technology
ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip
ATSAM4CP16C-EK Obsoleteविशेषता तुलना
| पैरामीटर | ATSAM4S-WPIR-RD | ATSAM4CP16C-EK |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | Development Boards | Development Boards |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Product Type | Reference Design / Evaluation Board | MCU 32-Bit Evaluation Board |
| Target MCU | ATSAM4S16C (ARM Cortex-M4) | — |
| Core Architecture | ARM Cortex-M4 with Thumb-2 and DSP instruction set | — |
| Maximum CPU Frequency | 120 MHz | — |
| Cache Memory | 2 Kbytes | — |
| Memory Protection Unit (MPU) | Yes | — |
| DSP Instruction Set | Yes | — |
| External SRAM | 1 Mbyte | — |
| Low-Frequency Crystal | 32.768 kHz | — |
| Main Oscillator | 12 MHz | — |
| On-Board LDO Regulator | Yes | — |
| Image Sensor Interface | Yes | — |
| PIR Sensor Interface | Yes | — |
| ZigBee Module Connector | Yes | — |
| LCD Interface | Yes | — |
| JTAG Debug Connector | Yes | — |
| Battery Holder | Yes | — |
| Pin-to-Pin Compatibility | SAM3N, SAM3S families | — |
| Series | AT91SAM | SAM4CP |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS Status] |
| Target Device | — | ATSAM4CP16C (SAM4CP series) |
| Core | — | Dual-core 32-bit ARM Cortex-M4 |
| Core Speed | — | 120 MHz per core |
| Flash Memory | — | 1 MB embedded |
| SRAM | — | 128 KB plus on-chip cache |
| Crypto Engine | — | Advanced cryptographic engine |
| PLC Modem | — | G3-PLC modem |
| PLC Profiles | — | CENELEC, ARIB, FCC |
| Supported Standards | — | G3-PLC specification |
| Architecture | — | Stacked dies (per distributor data) |
| Board Category | — | Embedded MCU, DSP Evaluation Boards |
| Packaging | — | Box |
| ऑपरेटिंग तापमान | — | [DATA_NEEDED: Operating Temperature] |
| Board Dimensions | — | [DATA_NEEDED: Board Dimensions] |