ATSAM4S-WPIR-RD vs ATSAM4CP16C-EK Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng ATSAM4S-WPIR-RD sa pamamagitan ng Microchip Technology at ATSAM4CP16C-EK sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
ATSAM4S-WPIR-RD ATSAM4S-WPIR-RD - SAM4S16 PIR Camera Reference Design | Microchip

ATSAM4S-WPIR-RD - SAM4S16 PIR Camera Reference Design | Microchip

ATSAM4S-WPIR-RD ✓ Nakahanda
Microchip Technology
ATSAM4CP16C-EK ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip

ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip

ATSAM4CP16C-EK Obsolete

Pagsanggunian na paghahambing

Parametro ATSAM4S-WPIR-RD ATSAM4CP16C-EK
Brand Microchip Technology Microchip Technology
Kategorya Development Boards Development Boards
Katayuan ng Lifecycle Aktibo Obsolete
Product Type Reference Design / Evaluation Board MCU 32-Bit Evaluation Board
Target MCU ATSAM4S16C (ARM Cortex-M4) —
Core Architecture ARM Cortex-M4 with Thumb-2 and DSP instruction set —
Maximum CPU Frequency 120 MHz —
Cache Memory 2 Kbytes —
Memory Protection Unit (MPU) Yes —
DSP Instruction Set Yes —
External SRAM 1 Mbyte —
Low-Frequency Crystal 32.768 kHz —
Main Oscillator 12 MHz —
On-Board LDO Regulator Yes —
Image Sensor Interface Yes —
PIR Sensor Interface Yes —
ZigBee Module Connector Yes —
LCD Interface Yes —
JTAG Debug Connector Yes —
Battery Holder Yes —
Pin-to-Pin Compatibility SAM3N, SAM3S families —
Series AT91SAM SAM4CP
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS Status]
Target Device — ATSAM4CP16C (SAM4CP series)
Core — Dual-core 32-bit ARM Cortex-M4
Core Speed — 120 MHz per core
Flash Memory — 1 MB embedded
SRAM — 128 KB plus on-chip cache
Crypto Engine — Advanced cryptographic engine
PLC Modem — G3-PLC modem
PLC Profiles — CENELEC, ARIB, FCC
Supported Standards — G3-PLC specification
Architecture — Stacked dies (per distributor data)
Board Category — Embedded MCU, DSP Evaluation Boards
Packaging — Box
Temperature na Operasyon — [DATA_NEEDED: Operating Temperature]
Board Dimensions — [DATA_NEEDED: Board Dimensions]

Mga Datasheets at Resources

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