ATSAMA5D27C-D1G-CUR vs ATSAMA5D27A-CUR तुलना
विस्तृत दोनों ओर की तुलना ATSAMA5D27C-D1G-CUR द्वारा Microchip Technology और ATSAMA5D27A-CUR द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
ATSAMA5D27C-D1G-CUR - 500MHz Cortex-A5 MPU 1Gbit DDR2 SiP | Microchip
ATSAMA5D27C-D1G-CUR ✓ सक्रियMicrochip Technology
ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip
ATSAMA5D27A-CUR ✓ सक्रियविशेषता तुलना
| पैरामीटर | ATSAMA5D27C-D1G-CUR | ATSAMA5D27A-CUR |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Core Architecture | ARM Cortex-A5 (32-bit, single-core) | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB |
| Integrated DRAM | 1 Gbit DDR2 SDRAM (SiP) | — |
| External Memory Controller | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3, plus QSPI and e.MMC | — |
| पैकेज | 289-TFBGA (14x14 mm, 0.8 mm pitch) | 289-LFBGA (14x14 mm) |
| Supply Voltage (Core) | 1.2 V (typical) | — |
| ऑपरेटिंग तापमान | -40 C to +85 C (industrial) | -40 C to +85 C (Industrial, MRLA marking) |
| Ethernet | 1x RGMII + 1x RMII (Gigabit-capable EMAC) | — |
| USB | 2x HS USB (one Host, one Device) | — |
| CAN | 2x CAN-FD controllers | — |
| Flexible Serial (FLEXCOM) | 3x (USART/SPI/TWI configurable) | — |
| Image Sensor Interface (ISI) | Up to 24-bit parallel camera input | — |
| Touch Controller | Peripheral Touch Controller (PTC) | — |
| Audio Subsystem | Embedded SSC + sample-rate converters | — |
| Cryptography | AES, SHA, TRNG, secure boot, monotonic counters | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL स्तर | [DATA_NEEDED: MSL rating] | 3 |
| RoHS स्थिति | Compliant | Compliant |
| Series | — | SAMA5D2 |
| Core | — | ARM Cortex-A5 (1 core, 32-bit) |
| Maximum Junction Temperature | — | 105 C |
| Ball Pitch | — | 0.8 mm |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Cache | — | 32 KB I-cache, 32 KB D-cache |
| FPU / NEON | — | Yes (VFPv4 + NEON) |
| AES-OTF (On-The-Fly) | — | Yes |
| CAN-FD Controllers | — | 2 |
| HSIC Interface | — | Yes |
| Peripheral Touch Controller | — | Yes (PTC) |
| Backup Mode Current | — | 5 uA (typ) |
| Packaging | — | Tape & Reel (TR) |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |