EP1M120F484C6 vs EP1M120B484C6 तुलना
विस्तृत दोनों ओर की तुलना EP1M120F484C6 द्वारा Intel और EP1M120B484C6 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP1M120F484C6 | EP1M120B484C6 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | Mercury (APEX EP1M) | Mercury (ACEX 1M) |
| Typical Gates | 120,000 | — |
| Logic Cells | 4,800 | — |
| Logic Elements (LEs) | 49,152 (per distributor listing) | — |
| User I/O | 303 | — |
| Logic Array Blocks (LABs) | 480 | — |
| पैकेज | 484-ball FC-FBGA (FineLine BGA) | 484-ball FineLine BGA (BGA-484) |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Core Supply Voltage | 1.8 V | — |
| Logic Family | CMOS | — |
| ऑपरेटिंग तापमान | 0 C to +85 C (Commercial) | — |
| Integrated Transceivers | High-speed CDR to 1.25 Gbps | — |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / ROM / CAM) | — |
| Process Technology | [DATA_NEEDED: process node] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 120 LE |
| Maximum Logic Elements | — | [DATA_NEEDED: maximum logic elements] |
| Flip-Flops | — | 4,800 |
| User I/O Pins (max) | — | 303 |
| Configuration Memory | — | SRAM-based (volatile, re-load on power-up) |
| Peak Reflow Temperature | — | 220 °C |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Process Node | — | 0.18 µm |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Configuration Modes | — | PS, AS, JTAG |
| Design Software | — | Quartus II (legacy support required) |