EP1M120F484C6 vs EP1M120B484C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1M120F484C6 disebabkan oleh Intel dan EP1M120B484C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1M120F484C6 | EP1M120B484C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Mercury (APEX EP1M) | Mercury (ACEX 1M) |
| Typical Gates | 120,000 | — |
| Logic Cells | 4,800 | — |
| Logic Elements (LEs) | 49,152 (per distributor listing) | — |
| User I/O | 303 | — |
| Logic Array Blocks (LABs) | 480 | — |
| Kemasan | 484-ball FC-FBGA (FineLine BGA) | 484-ball FineLine BGA (BGA-484) |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Core Supply Voltage | 1.8 V | — |
| Logic Family | CMOS | — |
| Suhu Operasi | 0 C to +85 C (Commercial) | — |
| Integrated Transceivers | High-speed CDR to 1.25 Gbps | — |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / ROM / CAM) | — |
| Process Technology | [DATA_NEEDED: process node] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 120 LE |
| Maximum Logic Elements | — | [DATA_NEEDED: maximum logic elements] |
| Flip-Flops | — | 4,800 |
| User I/O Pins (max) | — | 303 |
| Configuration Memory | — | SRAM-based (volatile, re-load on power-up) |
| Peak Reflow Temperature | — | 220 °C |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Process Node | — | 0.18 µm |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Configuration Modes | — | PS, AS, JTAG |
| Design Software | — | Quartus II (legacy support required) |