EP2A40F1020C9N vs EP2A40F1020C8N तुलना
विस्तृत दोनों ओर की तुलना EP2A40F1020C9N द्वारा Intel और EP2A40F1020C8N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2A40F1020C9N | EP2A40F1020C8N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | APEX II | — |
| Series | EP2A40 | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Family | CMOS | — |
| System Gates | 1.5 M | — |
| Logic Cells / Elements | 38,400 | — |
| Maximum Operating Frequency | 366 MHz | — |
| Propagation Delay | 1.55 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | — |
| User I/O Pins | 735 | — |
| Total Pins | 1020 | — |
| पैकेज | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine | — |
| ऑपरेटिंग तापमान | 0 °C to 85 °C | 0 °C to 85 °C |
| I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| On-chip Memory | Embedded System Blocks (ESB) for RAM/ROM | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | unknown | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |