EP2AGX190FF35I3N vs EP2AGX190FF35I3G तुलना
विस्तृत दोनों ओर की तुलना EP2AGX190FF35I3N द्वारा Intel और EP2AGX190FF35I3G द्वारा Altera. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel
EP2AGX190FF35I3N ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP2AGX190FF35I3N | EP2AGX190FF35I3G |
|---|---|---|
| ब्रांड | Intel | Altera |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | अंतिम बार खरीदें |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 181,165 | — |
| Logic Array Blocks (LABs) | 7,612 | — |
| User I/O Pins | 612 | 612 |
| Process Technology | 40 nm TSMC low-power | — |
| Core Voltage | 0.9 V | 0.9 V |
| Transceiver Speed (max) | 3.75 Gbps (data rate, per family datasheet) | — |
| Total Transceivers | [DATA_NEEDED: transceiver count per FF35 package] | — |
| Embedded Memory | [DATA_NEEDED: M20K block count and total bits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count for FF35 device] | [DATA_NEEDED: PLL count] |
| पैकेज | 1152-ball FC-FBGA (FCBGA), 35 mm | 1152-ball FC-FBGA (FF35), 35 mm body |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (flip-chip BGA) |
| ऑपरेटिंग तापमान | -40 °C to +100 °C (industrial, I3 grade) | -40 °C to +100 °C (industrial, suffix I) |
| Configuration | Serial / Parallel, supports encryption and remote update | — |
| RoHS स्थिति | Compliant (per Altera/Intel product page) | Compliant (suffix G) |
| Logic Elements (LE) | — | 181,165 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 10,177,536 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | 8 high-speed transceiver channels (multi-gigabit) |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| I/O Voltage Standards | — | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Ball Pitch | — | [DATA_NEEDED: 1.0 mm (typical for FF35)] |
| Lead-Free | — | Yes |
| Programming Toolchain | — | Quartus II / Quartus Prime |