EP2AGX190FF35I3N vs EP2AGX190FF35I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX190FF35I3N disebabkan oleh Intel dan EP2AGX190FF35I3G disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2AGX190FF35I3N EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

EP2AGX190FF35I3N ⚠ Bahagian terakhir untuk beli
Altera
EP2AGX190FF35I3G EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

EP2AGX190FF35I3G ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2AGX190FF35I3N EP2AGX190FF35I3G
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Family Arria II GX Arria II GX
Logic Elements 181,165 —
Logic Array Blocks (LABs) 7,612 —
User I/O Pins 612 612
Process Technology 40 nm TSMC low-power —
Core Voltage 0.9 V 0.9 V
Transceiver Speed (max) 3.75 Gbps (data rate, per family datasheet) —
Total Transceivers [DATA_NEEDED: transceiver count per FF35 package] —
Embedded Memory [DATA_NEEDED: M20K block count and total bits] —
DSP Blocks [DATA_NEEDED: variable-precision DSP block count] —
PLLs [DATA_NEEDED: PLL count for FF35 device] [DATA_NEEDED: PLL count]
Kemasan 1152-ball FC-FBGA (FCBGA), 35 mm 1152-ball FC-FBGA (FF35), 35 mm body
Jenis Pemasangan Surface Mount Surface Mount (flip-chip BGA)
Suhu Operasi -40 °C to +100 °C (industrial, I3 grade) -40 °C to +100 °C (industrial, suffix I)
Configuration Serial / Parallel, supports encryption and remote update —
Status RoHS Compliant (per Altera/Intel product page) Compliant (suffix G)
Logic Elements (LE) — 181,165
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (bits) — 10,177,536
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Transceivers — 8 high-speed transceiver channels (multi-gigabit)
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
I/O Voltage Standards — 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL)
Process Node — 40 nm
Speed Grade — 3
Ball Pitch — [DATA_NEEDED: 1.0 mm (typical for FF35)]
Lead-Free — Yes
Programming Toolchain — Quartus II / Quartus Prime

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