EP2AGX190FF35I3N vs EP2AGX190FF35I3G 比較
詳細並排比較 EP2AGX190FF35I3N 由 Intel 與 EP2AGX190FF35I3G 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel
EP2AGX190FF35I3N ⚠ 最後購買機會規格比較
| 參數 | EP2AGX190FF35I3N | EP2AGX190FF35I3G |
|---|---|---|
| 品牌 | Intel | Altera |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 181,165 | — |
| Logic Array Blocks (LABs) | 7,612 | — |
| User I/O Pins | 612 | 612 |
| Process Technology | 40 nm TSMC low-power | — |
| Core Voltage | 0.9 V | 0.9 V |
| Transceiver Speed (max) | 3.75 Gbps (data rate, per family datasheet) | — |
| Total Transceivers | [DATA_NEEDED: transceiver count per FF35 package] | — |
| Embedded Memory | [DATA_NEEDED: M20K block count and total bits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count for FF35 device] | [DATA_NEEDED: PLL count] |
| 封裝 | 1152-ball FC-FBGA (FCBGA), 35 mm | 1152-ball FC-FBGA (FF35), 35 mm body |
| 安裝類型 | Surface Mount | Surface Mount (flip-chip BGA) |
| 工作溫度 | -40 °C to +100 °C (industrial, I3 grade) | -40 °C to +100 °C (industrial, suffix I) |
| Configuration | Serial / Parallel, supports encryption and remote update | — |
| RoHS 狀態 | Compliant (per Altera/Intel product page) | Compliant (suffix G) |
| Logic Elements (LE) | — | 181,165 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 10,177,536 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Transceivers | — | 8 high-speed transceiver channels (multi-gigabit) |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| I/O Voltage Standards | — | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Ball Pitch | — | [DATA_NEEDED: 1.0 mm (typical for FF35)] |
| Lead-Free | — | Yes |
| Programming Toolchain | — | Quartus II / Quartus Prime |