EP2AGX65DF29C6G vs EP2AGX65DF29I3N तुलना
विस्तृत दोनों ओर की तुलना EP2AGX65DF29C6G द्वारा Intel और EP2AGX65DF29I3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX65DF29C6G | EP2AGX65DF29I3N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | — |
| पैकेज | 780-pin FC-FBGA | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| माउंटिंग प्रकार | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| ऑपरेटिंग तापमान रेंज | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | -3 |
| RoHS स्थिति | Compliant | Compliant (Pb-free N suffix) |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Logic Elements (LE) | — | 60214 |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| ऑपरेटिंग तापमान | — | -40 C to +100 C (Industrial) |
| Transceivers | — | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |