EP2AGX65DF29C6G vs EP2AGX65DF29I3N 比較
詳細並排比較 EP2AGX65DF29C6G 由 Intel 與 EP2AGX65DF29I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX65DF29C6G | EP2AGX65DF29I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | — |
| 封裝 | 780-pin FC-FBGA | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| 工作溫度範圍 | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | -3 |
| RoHS 狀態 | Compliant | Compliant (Pb-free N suffix) |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Logic Elements (LE) | — | 60214 |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| 工作溫度 | — | -40 C to +100 C (Industrial) |
| Transceivers | — | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |