EP2AGX65DF29C6G vs EP2AGX65DF29I3N Perbandingan
Perbandingan bersamaan detil EP2AGX65DF29C6G dari Intel dan EP2AGX65DF29I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX65DF29C6G | EP2AGX65DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GX | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | — |
| Paket | 780-pin FC-FBGA | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Rentang Suhu Kerja | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | -3 |
| Status RoHS | Compliant | Compliant (Pb-free N suffix) |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Process Node | — | 40 nm TSMC low-power |
| Logic Elements (LE) | — | 60214 |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| User I/O Count | — | 364 |
| Operating Frequency (max) | — | 500 MHz |
| Suhu Kerja | — | -40 C to +100 C (Industrial) |
| Transceivers | — | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |