EP2AGZ350HF40C3N vs EP2AGZ350HF40C2N तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ350HF40C3N द्वारा Intel और EP2AGZ350HF40C2N द्वारा Altera. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGZ350HF40C3N | EP2AGZ350HF40C2N |
|---|---|---|
| ब्रांड | Intel | Altera |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Dedicated 18x18 multipliers |
| Transceivers | Up to 24 (per family datasheet) | Up to 16 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| पैकेज | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40), 40 mm x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip BGA) | Surface Mount (FCBGA) |
| Embedded Memory | — | approximately 20 Mbits |
| Speed Grade | — | C2 (commercial) |
| ऑपरेटिंग तापमान | — | 0C to +85C (commercial, per N suffix) |
| Process Node | — | 40 nm low-power |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, differential standards |
| External Memory Support | — | DDR3, QDR II+, RLDRAM II |
| Configuration Method | — | Quartus II design suite, JTAG, passive/active serial |
| RoHS स्थिति | — | Compliant (per product listing) |