EP2AGZ350HF40C3N vs EP2AGZ350HF40C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3N sa pamamagitan ng Intel at EP2AGZ350HF40C2N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40C3N | EP2AGZ350HF40C2N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Dedicated 18x18 multipliers |
| Transceivers | Up to 24 (per family datasheet) | Up to 16 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Packhaging | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40), 40 mm x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (FCBGA) |
| Embedded Memory | — | approximately 20 Mbits |
| Speed Grade | — | C2 (commercial) |
| Temperature na Operasyon | — | 0C to +85C (commercial, per N suffix) |
| Process Node | — | 40 nm low-power |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, differential standards |
| External Memory Support | — | DDR3, QDR II+, RLDRAM II |
| Configuration Method | — | Quartus II design suite, JTAG, passive/active serial |
| Tindminan RoHS | — | Compliant (per product listing) |