EP2AGZ350HF40C3N vs EP2AGZ350HF40C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350HF40C3N disebabkan oleh Intel dan EP2AGZ350HF40C2N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350HF40C3N | EP2AGZ350HF40C2N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 350,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Dedicated 18x18 multipliers |
| Transceivers | Up to 24 (per family datasheet) | Up to 16 channels |
| Transceiver Data Rate | Up to 6.553 Gbps | Up to 6.375 Gbps |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm low-power | — |
| Kemasan | 1517-ball FCBGA (HF40) | 1517-ball FCBGA (HF40), 40 mm x 40 mm |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Mode | FPP / AS / JTAG | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (FCBGA) |
| Embedded Memory | — | approximately 20 Mbits |
| Speed Grade | — | C2 (commercial) |
| Suhu Operasi | — | 0C to +85C (commercial, per N suffix) |
| Process Node | — | 40 nm low-power |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, differential standards |
| External Memory Support | — | DDR3, QDR II+, RLDRAM II |
| Configuration Method | — | Quartus II design suite, JTAG, passive/active serial |
| Status RoHS | — | Compliant (per product listing) |