EP2AGZ350HF40I2N vs EP2AGZ350HF40C3N तुलना
विस्तृत दोनों ओर की तुलना EP2AGZ350HF40I2N द्वारा Intel और EP2AGZ350HF40C3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGZ350HF40I2N | EP2AGZ350HF40C3N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | सक्रिय |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 348,500 |
| पैकेज | 1517-pin FBGA (HF40) | 1517-ball FCBGA (HF40) |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | Up to 24 (per family datasheet) |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| RoHS स्थिति | Compliant | — |
| Lead-Free | Yes | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| MSL स्तर | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm low-power |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |