EP2S180F1020C3 vs EP2S180F1020C5N तुलना
विस्तृत दोनों ओर की तुलना EP2S180F1020C3 द्वारा Intel और EP2S180F1020C5N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2S180F1020C3 | EP2S180F1020C5N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Series | Stratix II | — |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| पैकेज | 1020-ball FBGA (flip-chip BGA) | 1020-BBGA, FCBGA (33x33 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Speed Grade | C3 | C5 (commercial) |
| ऑपरेटिंग तापमान | Commercial (0C to +85C) | 0C to +85C (commercial) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | Compliant (N suffix = lead-free) |
| Family | — | Stratix II |
| Logic Elements | — | 179400 |
| LABs/CLBs | — | 8970 |
| Total RAM Bits | — | 9383040 |
| User I/O | — | 742 |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| Process Technology | — | 90 nm |
| Number of Terminals | — | 1020 (BGA ball grid) |
| Lead Free | — | Yes (Pb-free terminal finish) |
| Configuration | — | SRAM-based, JTAG / Active Serial |