EP2S180F1020C3 vs EP2S180F1020C5N Perbandingan
Perbandingan bersamaan detil EP2S180F1020C3 dari Intel dan EP2S180F1020C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020C3 | EP2S180F1020C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Series | Stratix II | — |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Paket | 1020-ball FBGA (flip-chip BGA) | 1020-BBGA, FCBGA (33x33 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Speed Grade | C3 | C5 (commercial) |
| Suhu Kerja | Commercial (0C to +85C) | 0C to +85C (commercial) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (N suffix = lead-free) |
| Family | — | Stratix II |
| Logic Elements | — | 179400 |
| LABs/CLBs | — | 8970 |
| Total RAM Bits | — | 9383040 |
| User I/O | — | 742 |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| Process Technology | — | 90 nm |
| Number of Terminals | — | 1020 (BGA ball grid) |
| Lead Free | — | Yes (Pb-free terminal finish) |
| Configuration | — | SRAM-based, JTAG / Active Serial |