EP2S180F1508C4TT vs EP2S180F1508C4 तुलना
विस्तृत दोनों ओर की तुलना EP2S180F1508C4TT द्वारा Altera और EP2S180F1508C4 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Altera
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
EP2S180F1508C4TT Obsoleteविशेषता तुलना
| पैरामीटर | EP2S180F1508C4TT | EP2S180F1508C4 |
|---|---|---|
| ब्रांड | Altera | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | सक्रिय |
| Product Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix II | — |
| Logic Elements | approximately 180,000 | — |
| User I/O | 1,170 pins | — |
| Logic Array Blocks | 8,970 LABs | — |
| पैकेज | 1,508-ball FBGA | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Temperature Grade | -T | — |
| Configuration Mechanism | [DATA_NEEDED: configuration mechanism] | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage] | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature range] |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Typical Power Dissipation | [DATA_NEEDED: typical power dissipation] | — |
| RoHS स्थिति | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| सप्लाई वोल्टेज | — | 1.15 V to 1.25 V |
| Process Technology | — | 90 nm |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| पैकेज / केस | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |