EP2S180F1508C4TT vs EP2S180F1508C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1508C4TT sa pamamagitan ng Altera at EP2S180F1508C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
EP2S180F1508C4TT Obsolete
Pagsanggunian na paghahambing
| Parametro | EP2S180F1508C4TT | EP2S180F1508C4 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Product Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix II | — |
| Logic Elements | approximately 180,000 | — |
| User I/O | 1,170 pins | — |
| Logic Array Blocks | 8,970 LABs | — |
| Packhaging | 1,508-ball FBGA | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature Grade | -T | — |
| Configuration Mechanism | [DATA_NEEDED: configuration mechanism] | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature range] |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Typical Power Dissipation | [DATA_NEEDED: typical power dissipation] | — |
| Tindminan RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| Volte ng Pagbibigay | — | 1.15 V to 1.25 V |
| Process Technology | — | 90 nm |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Packhaging / Kaso | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |