EP2SGX60DF780C3 vs EP2SGX60CF780C5N तुलना
विस्तृत दोनों ओर की तुलना EP2SGX60DF780C3 द्वारा Intel और EP2SGX60CF780C5N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP2SGX60DF780C3 | EP2SGX60CF780C5N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | अंतिम बार खरीदें |
| Family | Stratix II GX | — |
| Series | Stratix II | Stratix II GX |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 (approximately 2.5 Mbit) |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 717 MHz |
| पैकेज | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | — |
| RoHS स्थिति | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Logic Elements | — | 60,440 (60K LE) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |