EP2SGX60DF780C3 vs EP2SGX60CF780C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3 sa pamamagitan ng Intel at EP2SGX60CF780C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3 | EP2SGX60CF780C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II GX | — |
| Series | Stratix II | Stratix II GX |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 (approximately 2.5 Mbit) |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 717 MHz |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | — |
| Tindminan RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Logic Elements | — | 60,440 (60K LE) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |