EP2SGX60DF780C3 vs EP2SGX60CF780C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3 disebabkan oleh Intel dan EP2SGX60CF780C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60DF780C3 | EP2SGX60CF780C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Family | Stratix II GX | — |
| Series | Stratix II | Stratix II GX |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 (approximately 2.5 Mbit) |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 717 MHz |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | — |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Logic Elements | — | 60,440 (60K LE) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |