EP3C40F780C8 vs EP3C40F780I8N तुलना
विस्तृत दोनों ओर की तुलना EP3C40F780C8 द्वारा Intel और EP3C40F780I8N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3C40F780C8 | EP3C40F780I8N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Cyclone III | Cyclone III |
| Series | EP3C40 | — |
| Logic Elements | 39,600 | — |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) | — |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) | — |
| Embedded 18x18 Multipliers | 126 | — |
| General Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 535 | — |
| Process Technology | 65 nm low-power CMOS | TSMC 65 nm low-power CMOS |
| पैकेज | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F780) |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) | — |
| Configuration | Serial (AS) / Parallel (AP) / JTAG | — |
| RoHS स्थिति | Compliant | Compliant |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs/CLBs) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (Kbits) | — | 1,134 |
| Embedded Multipliers (18x18) | — | 126 |
| Number of PLLs | — | 4 |
| User I/O Pins | — | 535 |
| I/O Banks | — | 20 |
| Nominal Core Supply Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Package Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| Configuration Modes | — | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel |
| MSL स्तर | — | 3 |