EP3CLS100F484C8N vs EP3CLS100F484C7N तुलना
विस्तृत दोनों ओर की तुलना EP3CLS100F484C8N द्वारा Intel और EP3CLS100F484C7N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3CLS100F484C8N | EP3CLS100F484C7N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 100,448 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | C7 |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| ऑपरेटिंग तापमान | 0°C to +85°C (commercial grade) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| RoHS स्थिति | Compliant (Pb-free, 'N' suffix) | Compliant (lead-free, N suffix) |
| MSL स्तर | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone III LS |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| पैकेज | — | 484-ball FineLine BGA (FBGA-484) |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Configuration Method | — | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Design Software | — | Quartus II / Intel Quartus Prime |