EP3CLS100F484C8N vs EP3CLS100F484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS100F484C8N disebabkan oleh Intel dan EP3CLS100F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS100F484C8N | EP3CLS100F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 100,448 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | C7 |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| Suhu Operasi | 0°C to +85°C (commercial grade) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant (lead-free, N suffix) |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone III LS |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Kemasan | — | 484-ball FineLine BGA (FBGA-484) |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Configuration Method | — | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Design Software | — | Quartus II / Intel Quartus Prime |