EP3SE110F780I4L vs EP3SE110F780I3N तुलना
विस्तृत दोनों ओर की तुलना EP3SE110F780I4L द्वारा Intel और EP3SE110F780I3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N Nrndविशेषता तुलना
| पैरामीटर | EP3SE110F780I4L | EP3SE110F780I3N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| LABs (Logic Array Blocks) | 4,300 | — |
| User I/Os | 488 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | — |
| Maximum Operating Frequency | 375 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | 1.1 V (range 1.05 V to 1.15 V) |
| पैकेज | 780-pin FC-FBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| माउंटिंग प्रकार | Surface Mount (FC-FBGA) | Surface Mount (BGA) |
| RoHS स्थिति | Compliant (per legacy Altera data) | Compliant |
| Product Status | Not Recommended for New Designs (NRND) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| ऑपरेटिंग तापमान | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| MSL स्तर | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |