EP3SE110F780I4L vs EP3SE110F780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780I4L disebabkan oleh Intel dan EP3SE110F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPengandingan Spesifikasi
| Parametr | EP3SE110F780I4L | EP3SE110F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| LABs (Logic Array Blocks) | 4,300 | — |
| User I/Os | 488 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | — |
| Maximum Operating Frequency | 375 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | 1.1 V (range 1.05 V to 1.15 V) |
| Kemasan | 780-pin FC-FBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| Jenis Pemasangan | Surface Mount (FC-FBGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per legacy Altera data) | Compliant |
| Product Status | Not Recommended for New Designs (NRND) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| Suhu Operasi | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |