EP3SE110F780I4L vs EP3SE110F780I3N Perbandingan
Perbandingan bersamaan detil EP3SE110F780I4L dari Intel dan EP3SE110F780I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPerbandingan Spesifikasi
| Parameter Umum | EP3SE110F780I4L | EP3SE110F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| LABs (Logic Array Blocks) | 4,300 | — |
| User I/Os | 488 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | — |
| Maximum Operating Frequency | 375 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | 1.1 V (range 1.05 V to 1.15 V) |
| Paket | 780-pin FC-FBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| Tipe Mounting | Surface Mount (FC-FBGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per legacy Altera data) | Compliant |
| Product Status | Not Recommended for New Designs (NRND) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| Suhu Kerja | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |