EP3SE260H780I4L vs EP3SE260H780I4N तुलना
विस्तृत दोनों ओर की तुलना EP3SE260H780I4L द्वारा Intel और EP3SE260H780I4N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP3SE260H780I4L | EP3SE260H780I4N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | अंतिम बार खरीदें |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip) | — |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| ऑपरेटिंग तापमान | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| RoHS स्थिति | Compliant (lead-free) | Compliant |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 450 MHz |
| पैकेज | — | 780-pin FC-HFBGA (FCBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |