EP3SE260H780I4L vs EP3SE260H780I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Huling PagbiliIntel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780I4L | EP3SE260H780I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip) | — |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| Temperature na Operasyon | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 488 |
| Maximum Operating Frequency | — | 450 MHz |
| Packhaging | — | 780-pin FC-HFBGA (FCBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |