EP3SL200H780I4L vs EP3SL200H780I3 तुलना
विस्तृत दोनों ओर की तुलना EP3SL200H780I4L द्वारा Intel और EP3SL200H780I3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SL200H780I4L | EP3SL200H780I3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | — |
| Embedded Memory (Bits) | 10,901,504 | — |
| Maximum User I/O | 488 | — |
| Core Supply Voltage | 0.86 V to 1.15 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Internal Performance | 375 MHz | — |
| पैकेज | 780-pin FC-HFBGA (Flip-Chip) | 780-BBGA, FCBGA (HBGA-780) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceivers | Up to 24 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | 9x9 / 18x18 / 36x36 multipliers | — |
| Memory Interface Support | DDR3, DDR2, DDR, QDR II+, RLDRAM II | — |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan | — |
| RoHS स्थिति | Compliant | — |
| Speed Grade | I4 (Industrial) | — |
| HardCopy Support | Compatible (Lattice-style migration path via HardCopy III) | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |