EP3SL200H780I4L vs EP3SL200H780I3 比較

詳細並排比較 EP3SL200H780I4L 由 Intel 與 EP3SL200H780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL200H780I4L EP3SL200H780I3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III L Stratix III
Logic Elements 200,000 200,000
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (Bits) 10,901,504 —
Maximum User I/O 488 —
Core Supply Voltage 0.86 V to 1.15 V —
Process Technology 65 nm CMOS 65 nm CMOS
Internal Performance 375 MHz —
封裝 780-pin FC-HFBGA (Flip-Chip) 780-BBGA, FCBGA (HBGA-780)
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +100C (Industrial) -40C to +100C (Industrial)
Transceivers Up to 24 channels —
Transceiver Data Rate Up to 6.375 Gbps —
DSP Blocks 9x9 / 18x18 / 36x36 multipliers —
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II —
JTAG Support IEEE Std 1149.1 Boundary-Scan —
RoHS 狀態 Compliant —
Speed Grade I4 (Industrial) —
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) —
Series — Stratix III L
LABs (Logic Array Blocks) — 8000
Total RAM Bits — 10,901,504 (10,900 Kb)
User I/O Count — 488
Number of I/O Banks — [DATA_NEEDED: I/O banks]
Embedded Multipliers (DSP blocks) — 384 (18x18)
PLLs — 12
Core Voltage — 1.1 V
Maximum Operating Frequency — 717 MHz
Supplier Device Package — 780-FBGA (29x29 mm)
Lead-Free / RoHS — Compliant (lead-free)

資料表與資源

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