EPF10K250EFC672-1 vs EPF10K200EFC672-3 तुलना
विस्तृत दोनों ओर की तुलना EPF10K250EFC672-1 द्वारा Intel और EPF10K200EFC672-3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsoleteविशेषता तुलना
| पैरामीटर | EPF10K250EFC672-1 | EPF10K200EFC672-3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | FLEX 10KE | — |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| ऑपरेटिंग तापमान | 0C to +70C (Commercial) | 0 °C to +70 °C (commercial) |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Programming Technology | In-system, SRAM-based | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Configuration Interface | Serial (passive/active) | — |
| Speed Grade | -1 | — |
| Series | — | FLEX 10KE |
| Number of Logic Elements / Cells | — | 9,984 |
| Number of LABs / CLBs | — | 1248 |
| Total RAM Bits | — | 98,304 bits (12 EABs of 8 Kbits) |
| Number of I/O | — | 470 |
| Number of Gates (typical) | — | 200,000 |
| Supply Voltage - Operating | — | 2.3 V to 2.7 V (2.5 V nominal) |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Operating Frequency | — | 166.67 MHz |
| पैकेज / केस | — | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external configuration device) |
| Number of PLLs | — | 4 |
| MSL स्तर | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |