EPF10K250EFC672-1 vs EPF10K200EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K200EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-1 EPF10K200EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE —
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm —
Package Shape Square —
Terminal Form Ball —
Temperature na Operasyon 0C to +70C (Commercial) 0 °C to +70 °C (commercial)
Propagation Delay 0.4 ns 0.4 ns
Programming Technology In-system, SRAM-based —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Interface Serial (passive/active) —
Speed Grade -1 —
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Process Technology — 0.22 µm CMOS
Maximum Operating Frequency — 166.67 MHz
Packhaging / Kaso — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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