M1AFS1500-2FGG484I vs M1AFS1500-2FG676I तुलना
विस्तृत दोनों ओर की तुलना M1AFS1500-2FGG484I द्वारा Microchip Technology और M1AFS1500-2FG676I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS1500-2FGG484I - 1.5M Gate Fusion FPGA, 223 I/O | Microchip
M1AFS1500-2FGG484I ✓ सक्रियMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS1500-2FGG484I | M1AFS1500-2FG676I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Fusion (M1 series) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1500000 gates | 1.5 M |
| Logic Cells | 38400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| User I/O | 223 | — |
| Flash Configuration Memory | 276480 bits | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based CMOS | 130 nm CMOS |
| Speed Grade | 2 (25% faster than standard) | 2 |
| पैकेज | 484-ball FBGA (FGG484), 1.00 mm ball pitch | 676-ball FBGA (FG676) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial, junction) | — |
| Programmability | In-system reprogrammable flash (LivePro) | — |
| Volatility | Non-volatile (on-chip flash configuration) | — |
| Analog Peripherals | Mixed-signal configurable analog blocks | — |
| Clock Management | Comprehensive clock generation and management (CCM) | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| ऑपरेटिंग तापमान रेंज | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |