M1AFS1500-FGG676I vs M1AFS1500-1FGG676 तुलना
विस्तृत दोनों ओर की तुलना M1AFS1500-FGG676I द्वारा Microchip Technology और M1AFS1500-1FGG676 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS1500-FGG676I - 1.5M Gate Fusion FPGA 676FBGA | Microchip
M1AFS1500-FGG676I ✓ सक्रियMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS1500-FGG676I | M1AFS1500-1FGG676 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 1500000 | — |
| Technology | 130 nm Flash-based | 130 nm CMOS flash-based |
| User I/O | 252 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| पैकेज | 676-ball FBGA (27 x 27 mm) | — |
| ऑपरेटिंग तापमान | -40C to +100C (Industrial) | — |
| Configuration | Flash-based, single-chip, live-at-power-up | — |
| Max Frequency | 1098.9 MHz (system-level per distributor listing) | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Data Stream Support | 8, 16, and 32 bit | — |
| Analog Peripherals | Integrated mixed-signal (ADC, voltage/temperature monitoring) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| RoHS स्थिति | Compliant | unknown |
| Speed Grade | Standard (no dash speed suffix) | -1 |
| Junction Temperature Range | [DATA_NEEDED: TJ range] | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| अधिकतम क्लॉक फ़्रीक्वेंसी | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| पैकेज / केस | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| माउंटिंग स्टाइल | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Configuration Memory | — | Flash (non-volatile, live at power-up) |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |