M1AFS250-1FG256I vs M1AFS250-1FGG256I तुलना
विस्तृत दोनों ओर की तुलना M1AFS250-1FG256I द्वारा Microchip Technology और M1AFS250-1FGG256I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ सक्रियMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ सक्रियविशेषता तुलना
| पैरामीटर | M1AFS250-1FG256I | M1AFS250-1FGG256I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Fusion (M1 - with ARM Cortex-M1) | M1AFS250 (Fusion) |
| System Gates | 250000 gates | 250,000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| ऑपरेटिंग तापमान | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | — |
| पैकेज | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | — | 128-bit flash-based lock, AES decryption |
| ऑपरेटिंग सप्लाई वोल्टेज | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| पैकेज / केस | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| माउंटिंग स्टाइल | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| RoHS स्थिति | — | [DATA_NEEDED: RoHS status] |