M1AFS250-1FG256I vs M1AFS250-1FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FG256I sa pamamagitan ng Microchip Technology at M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ NakahandaMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-1FG256I | M1AFS250-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1 - with ARM Cortex-M1) | M1AFS250 (Fusion) |
| System Gates | 250000 gates | 250,000 gates |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Temperature na Operasyon | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | — |
| Packhaging | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | — | Nonvolatile flash (Live at Power-Up, LAPU) |
| Security | — | 128-bit flash-based lock, AES decryption |
| Supply Voltage na Operasyon | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packhaging / Kaso | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style ng Pagpapasok | — | SMD/SMT |
| Packaging | — | Tray |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |